Product · United States

BGA Reballing Stencil Kit For HUAWEI XIAOMI Sanmsung MTK OPPO WTR LG CPU IC Chip Tin Planting Soldering Android Solder Template

Lowest price: $5.56 · 1 store · price range $7.07 … $7.07 · 21% off the list price

Price history: 2 daily prices tracked since 2026-10-18; lowest $5.56, highest $5.56.

Price last confirmed by the store feed on 2026-10-30.

BGA Reballing Stencil Kit For HUAWEI XIAOMI Sanmsung MTK OPPO WTR LG CPU IC Chip Tin Planting Soldering Android Solder Template

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Store 1 (US)$5.56In stockGo to store

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