Product · United States

JTX N3 BGA Planting Tin Reballing Stencil Platform CellPhone Motherboard BGA110 BGA315 NAND IC Chip Template Solder Steel 1-3pc

Lowest price: $6.70 · 1 store · price range $6.70 … $6.70

Price history: 3 daily prices tracked since 2026-10-20; lowest $6.63, highest $6.70.

Price last confirmed by the store feed on 2026-10-30.

JTX N3 BGA Planting Tin Reballing Stencil Platform CellPhone Motherboard BGA110 BGA315 NAND IC Chip Template Solder Steel 1-3pc

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Store 1 (US)$6.70In stockGo to store

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