Product · United States

MIJING SP1 Chip Blade 2mm Ultra Thin PI Material Remove Black Glue Underfill for CPU IC BGA Chip Mobile Phone Repair Rework Tool

Lowest price: $9.47 · 1 store · price range $9.47 … $9.47

Price history: 3 daily prices tracked since 2026-10-20; lowest $9.45, highest $9.47.

Price last confirmed by the store feed on 2026-10-27.

MIJING SP1 Chip Blade 2mm Ultra Thin PI Material Remove Black Glue Underfill for CPU IC BGA Chip Mobile Phone Repair Rework Tool

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Store 1 (US)$9.47In stockGo to store

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