Product · United States

Vitrified Bond Silicon Wafer Back Grinding Wheel for Semiconductor Wafer Thinning Process 6A2T 209mm 320#

Lowest price: $2,406 · 1 store · price range $2,734 … $2,734 · 12% off the list price

Price history: 5 daily prices tracked since 2026-10-18; lowest $2,398, highest $2,406.

Price last confirmed by the store feed on 2026-10-27.

Vitrified Bond Silicon Wafer Back Grinding Wheel for Semiconductor Wafer Thinning Process 6A2T 209mm 320#

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Store 1 (US)$2,406In stockGo to store

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