Product · United States

MIJING MS1 Upgrade Hollow Heat Module Intelligent Desoldering Heating Platform For iPhone11-18PM Mainboard Layer Separation Tool

Lowest price: $14.94 · 1 store · price range $31.79 … $31.79 · 53% off the list price

Price history: 2 daily prices tracked since 2026-10-19; lowest $14.94, highest $14.95.

Price last confirmed by the store feed on 2026-10-20.

MIJING MS1 Upgrade Hollow Heat Module Intelligent Desoldering Heating Platform For iPhone11-18PM Mainboard Layer Separation Tool

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Store 1 (US)$14.94In stockGo to store

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