Product · United States

RELIFE RL-044 58Pc Android CPU BGA Chip Planting Tin Reballing Stencils for Qualcomm Snapdragon/Dimensity/Hisilicon Kirin/Exynos

Lowest price: $46.78 · 1 store · price range $93.57 … $93.57 · 50% off the list price

Price history: 2 daily prices tracked since 2026-10-18; lowest $46.78, highest $46.78.

Price last confirmed by the store feed on 2026-10-30.

RELIFE RL-044 58Pc Android CPU BGA Chip Planting Tin Reballing Stencils for Qualcomm Snapdragon/Dimensity/Hisilicon Kirin/Exynos

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Store 1 (US)$46.78In stockGo to store

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