Product · United States

Resin or Vitrified Diamond Back Grinding Wheel Used for CMP Polishing Processes for Semiconductor Wafers

Lowest price: $2,671 · 1 store · price range $2,671 … $2,671

Price history: 5 daily prices tracked since 2026-10-18; lowest $2,662, highest $2,671.

Price last confirmed by the store feed on 2026-10-27.

Resin or Vitrified Diamond Back Grinding Wheel Used for CMP Polishing Processes for Semiconductor Wafers

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Store 1 (US)$2,671In stockGo to store

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